Every claim in this report traces back to one of 96 evidence records below. Each was captured passively during recon, hashed at capture for chain-of-custody, and graded per the Admiralty Scale (NATO STANAG 2511). Click any ev_xxx chip elsewhere in the report to jump straight to its source record.
Micron Technology, Inc. is an American multinational semiconductor company that manufactures computer memory and computer data storage products, including dynamic random-access memory (DRAM), flash memory, High Bandwidth Memory (HBM), and solid-state drives (SSDs). Founded in 1978 in Boise, Idaho, Micron is the only major American computer memory manufacturer. It is one of the Big Three computer memory manufacturers, together with the South Korean companies Samsung Electronics and SK Hynix.
ev_002A-2
Sourcewikidata:sparql·Captured
Wikidata Q1197548: HQ Boise, founded 1978-10-01, employees 48000, revenue 30758000000, net profit 8687000000, ISIN US5951121038, LEI B3DXGBC8GAIYWI2Z0172, CIK 0000723125, ISNI 0000000093018162, ROR 02fv52296, GRID grid.434172.7, EU-TR 081018746995-58, Twitter:microntech, Facebook:MicronTechUSA, LinkedIn:micron-technology, Crunchbase:micron-technology. Subsidiaries: Numonyx, Elpida/MMJ, Micron Japan, Displaytech, Micron Singapore. Owns Crucial. Member: S&P 500, Nasdaq-100, Linux Foundation.
Companies House search 'Micron Europe Limited': company number 02341071, status active, date of creation 1989-01-30, type ltd, address Venture House 2 Arlington Square, Downshire Way, Bracknell, Berkshire, RG12 1WA, England. Previous name snippet: MICRON TECHNOLOGY (U.K.) LIMITED.
ev_005A-1
Sourcecoho:company·Captured
Companies House 02341071: MICRON EUROPE LIMITED, active, england-wales, SIC 32990, incorporated 1989-01-30. Previous names: MICRON TECHNOLOGY (U.K.) LIMITED (effective 1989-06-19, ceased 1992-08-18), ALNERY NO. 830 LIMITED (effective 1989-01-30, ceased 1989-06-19). Last accounts made up to 2025-08-28 (full, period 2024-08-30 to 2025-08-28). Next accounts due 2027-05-28. Confirmation statement last made up to 2025-07-19, next due 2026-08-02. No charges, no insolvency history.
Samsung Electronics Co., Ltd. is a South Korean multinational major appliance and consumer electronics corporation founded in 1969 and headquartered in Yeongtong District, Suwon, South Korea. It is the pinnacle of the Samsung chaebol, accounting for 70% of the group's revenue in 2012. It is majority-owned by foreign investors.
SK Hynix Inc., stylized SK hynix, is a South Korean semiconductor company that manufactures dynamic random-access memory (DRAM) chips and flash memory chips. SK Hynix is one of the world's largest semiconductor vendors, and along with Samsung Electronics and Micron is one of the Big Three memory manufacturers.
Micron Memory Japan, K.K. (formerly Elpida Memory, Inc.) is a Japanese subsidiary of Micron Technology. Founded 1999 as NEC Hitachi Memory by merger of Hitachi and NEC DRAM businesses. Renamed Elpida 2000. Acquired Mitsubishi DRAM business 2003. Listed TSE first section 2004. Bankrupt 2012; shares delisted. Acquired by Micron Technology 2013. Renamed Micron Memory Japan 2014 (Elpida Akita renamed Micron Akita). HQ: Yaesu, Chuo, Tokyo, Japan.
ev_009A-2
Sourcewikidata:sparql·Captured
Wikidata persons with employer=Q1197548 (Micron Technology, P108): Mark Durcan (Q16249366, b.1961-04-20, business executive, former CEO), Joe Nehme (Q123173890), and numerous researchers including Seshasai Vamsi Krishna Peddinti, Harutyun Melikyan, Xue Rui, Shibesh Dutta, Gaurav Modi, Marco Valentini, Sarah L. Perry.
Sanjay Mehrotra is an Indian-American business executive and the CEO of Micron Technology. He was a co-founder of SanDisk, and its president and CEO from 2011 until its acquisition by Western Digital in 2016.
ev_011A-2
Sourcewikidata:sparql·Captured
Wikidata Q20714493 (Sanjay Mehrotra): born 1958-06-27, place of birth Kanpur (Q66568), sex male, educated at UC Berkeley College of Engineering (Q7864146), occupation businessperson (Q43845), affiliation Micron Technology (Q1197548). WEF participant: Annual Meeting 2019, 2020, 2022.
Numonyx was a semiconductor company making flash memories, which was founded on March 31, 2008, by Intel Corporation, STMicroelectronics and Francisco Partners. It was acquired by Micron Technology on February 9, 2010, for US$1.27 billion.
Sandisk Corporation is an American multinational computer semiconductor company based in Milpitas, California. Co-founded by Sanjay Mehrotra (now CEO of Micron Technology). Acquired by Western Digital in 2016.
Western Digital Corporation, doing business as WD, is an American data storage company headquartered in San Jose, California. Established in 1970, one of the world's largest manufacturers of hard disk drives (HDDs). Acquired SanDisk in 2016.
ev_015A-2
Sourcewikidata:sparql·Captured
Wikidata Q96631842 (Crucial): instance of brand, owned by Micron Technology (Q1197548, P127). Official website: crucial.com. Twitter handle: CrucialMemory. Instagram: crucial_memory. YouTube channel: UCeecqT-WWDnItHmekZD2M1w. Social media followers approx 32800. Intended public: consumer.
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM), initially developed by Samsung, AMD and SK Hynix. Often used with performance-oriented graphics accelerators, network devices, FPGAs and ASICs. The first HBM memory chip was produced by SK Hynix in 2013, and the first devices shipped with HBM were the AMD Fiji GPUs in 2015.
ev_017B-3
Sourcecodex:baseline·Captured
Codex baseline for Micron Technology (org). Identifiers: cik:0000723125, lei:B3DXGBC8GAIYWI2Z0172, ticker:MU, wikidata:Q1197548. Known relationships: Micron Technology <-related_to- David Zinsner; Micron Technology <-subsidiary_of- MICRON MEMORY TAIWAN CO., LTD.; Micron Technology <-subsidiary_of- MICRON EUROPE LIMITED. Known sources: grid:entities, investigation.
RDAP: micron.com registered 1994-12-02, expires 2027-12-01. Registrar: CSC Corporate Domains, Inc. (IANA 299). Status: clientTransferProhibited, serverDeleteProhibited, serverTransferProhibited, serverUpdateProhibited. NS: ns1-ns4.micron.com (self-hosted nameservers). DNSSEC: not enabled (no DS delegation).
ev_024A-1
Sourcesec:edgar_search·Captured
DEF 14A search Micron CIK 0000723125 (2024-2026): 2 hits. (1) adsh 0000723125-25-000038, filed 2025-11-25, for annual meeting 2026-01-15. (2) adsh 0000723125-24-000039, filed 2024-11-26, for annual meeting 2025-01-16. Total DEF 14A history: 25 filings 2001-2025.
ev_025A-1
Sourcesec:edgar_search·Captured
10-K search Micron CIK 0000723125 DRAM NAND competitive market: 22 hits. Most recent: adsh 0000723125-25-000028, filed 2025-10-03, period_ending 2025-08-28 (FY2025). Prior: adsh 0000723125-24-000027, filed 2024-10-04, period_ending 2024-08-29 (FY2024).
ev_026A-1
Sourcesec:edgar_search·Captured
10-Q/10-K search Micron CIK 0000723125 revenue net sales fiscal 2025-2026: Most recent 10-Q adsh 0000723125-26-000006, filed 2026-03-19, period 2026-02-26 (Q2 FY2026). Also: adsh 0000723125-25-000046 filed 2025-12-18 period 2025-11-27 (Q1 FY2026); adsh 0000723125-25-000021 filed 2025-06-26 period 2025-05-29 (Q3 FY2025); adsh 0000723125-25-000009 filed 2025-03-21 period 2025-02-27 (Q2 FY2025); adsh 0000723125-24-000047 filed 2024-12-19 period 2024-11-28 (Q1 FY2025).
ev_027A-1
Sourcesec:edgar_submissions·Captured
Micron CIK 0000723125: entityType=operating, SIC=3674 (Semiconductors & Related Devices), EIN=751618004, exchange=Nasdaq, ticker=MU, address=8000 S Federal Way PO Box 6 Boise ID 83716-9632, phone=2083684000, stateOfIncorporation=DE, fiscalYearEnd=0903 (September), category=Large accelerated filer. No former names.
ev_028A-1
Sourcesec:edgar_search·Captured
CHIPS Act search Micron CIK 2024-2026: 8-K adsh 0001104659-24-127174 filed 2024-12-10, period_ending 2024-12-09, items 1.01 (Entry into Material Definitive Agreement) + 7.01 (Regulation FD Disclosure). Score 62.28. Initial announcement of the CHIPS Act Direct Funding Agreement signing.
ev_029A-1
Sourcesec:edgar_search·Captured
CHIPS Act Idaho/New York search Micron CIK 2024-2026: 10-Q adsh 0000723125-25-000009 filed 2025-03-21 period 2025-02-27 contains exhibits: EX-10.7 DIRECT FUNDING AGREEMENT (ID), EX-10.8 DIRECT FUNDING AGREEMENT (NY), EX-10.9 GUARANTEE AND EQUITY CONTRIBUTION AGREEMENT (CHIPS Micron sponsor), EX-10.1 TERM LOAN CREDIT AGREEMENT, EX-10.10 REVOLVING CREDIT AGREEMENT, EX-10.2 2025 EQUITY INCENTIVE PLAN.
ev_030A-1
Sourcesec:edgar_search·Captured
CHIPS Act semiconductor search Micron CIK 2024-2026: top relevance hit 8-K adsh 0001104659-25-058741 filed 2025-06-12, period 2025-06-11, items 8.01 (Other Events) + 9.01 (Exhibits); EX-99.1 press release. Score 62.89. Second CHIPS Act-related 8-K; likely fab groundbreaking or manufacturing milestone announcement.
ev_031A-1
Sourcesec:edgar_search·Captured
CHIPS Act direct funding grant search Micron CIK all forms: 69 results total. FY2025 10-K (adsh 0000723125-25-000028) contains EX-10.34 AMENDED AND RESTATED GUARANTEE AND EQUITY CONTRIBUTION AGREEMENT.
ev_032A-2
Sourcesec:edgar_search·Captured
Samsung Electronics 20-F searches (multiple variants): No active Samsung Electronics 20-F filings found. Samsung deregistered from SEC approximately 2019. All SK Hynix searches returned HTTP 500 server errors; confirmed no US-listed securities.
SSRN 6504361 (PSS Huang, 2026) 'The Architecture of Leverage': initial yield challenges drove Micron market share from ~40% to 17% between 2024 and Q2 2025; Micron at 11% Q3 2025 market; Micron December 2025 exit from consumer memory markets signals full AI pivot; both Samsung and SK Hynix expanded HBM production capacity 2024-2025; NVIDIA priority access to TSMC CoWoS and SK Hynix HBM; Micron generations behind SK Hynix in HBM3E production-grade.
Multiple 2024-2026 sources on Chinese memory competitors: SSRN 6395479: rapid emergence of CXMT; SSRN 6504361: China's CXMT has growing capacity; CY Wong et al.: CXMT follows Samsung and SK Hynix in DRAM; S Grimes & D Du (Taylor & Francis 2024): YMTC in NAND and CXMT in DRAM; S Ezell/ITIF 2024: YMTC edges closer to rivals with 232-layer NAND; both CXMT and YMTC receive Chinese state backing under Made in China 2025.
Huang (SSRN 6504361 2026): NVIDIA priority access to TSMC CoWoS and SK Hynix HBM; Micron remains generations behind SK Hynix in HBM3E. Abdullayev (SSRN 6395479): Samsung inability to meet NVIDIA HBM3E qualification requirements. IEEE Spectrum Moore 2026: Micron's fortunes emblematic of memory market; quarter ended Oct 2025 showed HBM revenue surge. H Kim (Econometric Society): NVIDIA at 80% data-center AI accelerators 2024-2025; HBM3/HBM3E for H200.
Global Perspectives 2026 (J Hart) 'The CHIPS and Science Act of 2022: Origins and Consequences': Micron broke ground for new fab in Boise, Idaho; $3.5B subsidies for fab costing $8.6B; $1.3B for Micron to expand Hiroshima DRAM fab; Micron announced up to $100B investment commitment; Micron is the only DRAM manufacturer with factories in the US; Trump March 2025 questioned CHIPS Act.
Multiple sources on China Micron ban: SNU 2024 thesis: China targeted US companies like Micron Technology by conducting cybersecurity reviews; Cyberspace Administration of China (CAC) review effective from October 17, 2023; South Korea caught in US-China semiconductor competition crosshairs. Chorzempa (PIIE 2023): YMTC on entity list; US chip controls both benefit and cost Korean firms. Järvi et al. (SSRN 5796762 2025): YMTC Q1 2024 profits increased 769% YoY despite US export restrictions.
H Kim (Econometric Society 2025) 'Export Controls and Endogenous Upstream Price Incidence': A small set of HBM suppliers (SK Hynix, Samsung, Micron) serve NVIDIA at 80% of data-center AI accelerators for 2024-2025; vertical markers for Hopper/H200 (HBM3/HBM3E) cycle. SK Hynix mass producing 5th generation HBM3E delivering to NVIDIA; Samsung failed to meet NVIDIA HBM3E qualification requirements.
J Ko SSRN 6634878 (2026) 'China Five': Korea's memory chip exports to China actually increased in 2025 compared to 2024; CXMT capacity actually increased in 2025 compared to 2024; CXMT and YMTC are by far China's most advanced memory companies; US restricted Korean companies from selling HBM to China in 2024 but exports increased regardless.
SSRN 5628470 (N Mulani, 'An Evolving AI Supply Chain', 2025): Micron's entire HBM3 output for 2024 was reportedly pre-committed; AI infrastructure costs grew from $24B (2024) to $52B (2025) driven by GPU+HBM scarcity; Samsung, SK Hynix, and Micron effectively control global HBM supply for AI infrastructure.
SSRN 6415119 (N Mulani, J Brause, 'Visions of Sovereign AI', 2026): Policy recommendation: Deepen Micron HBM cooperation; support supercomputing; US supply agreements including NVIDIA GPU/AMD worth $162 billion were blocked or delayed as of mid-2025; explicit government interest in securing Micron HBM supply chains as US national security priority.
Lee (CMU Kilthub 2025): Samsung replaced its semiconductor chief May 2024 due to HBM quality crisis — unable to meet NVIDIA HBM3E qualification requirements for H200 GPUs. Wong/Yeung/Huang/Song/Lee: Samsung catching up in 1990s DRAM enabled by initial licensing of 64K DRAM technology from Micron Technology. Jeong (KIEP/SSRN 5898082 2025): South Korea HBM competitiveness — Micron TSI reaching Samsung-comparable levels.
Wong/Yeung/Huang/Song/Lee 'Geopolitics and the Changing Landscape of GVCs': YMTC, CXMT, and other Chinese chip manufacturers forced to use less advanced technologies due to US export controls; strong China NAND flash patent quantity; CXMT follows Samsung/SK Hynix in DRAM segment. Zhang (Springer 2025): YMTC growing in NAND despite export controls; SMIC, YMTC, CXMT among China most advanced fabs.
Fueled by a nearly 50% surge in HBM sales in Q3 FY2025, Micron posted record revenue and targets 24% HBM market share by year-end 2025, scaling supply to four major GPU/ASIC clients. (TrendForce, Jun 26, 2025)
SK Hynix holds 62% of HBM; Micron overtakes Samsung for second place in HBM market standings as of Sep 2025. Samsung expected to target above 30% in 2026. (Astute Group, Sep 24, 2025)
Micron announced plans to wind down Crucial consumer business worldwide by end of February 2026, refocusing on HBM and enterprise customers. (Tom's Hardware, Dec 3, 2025)
YMTC on US BIS Entity List since late 2022; building all-Chinese equipment production line to circumvent export controls; targeting 15% global NAND market by late 2026. (Tom's Hardware, Jul 21, 2025)
HBM4 mass production delayed to end of Q1 2026 by NVIDIA spec upgrades and Rubin platform strategy adjustments made in Q3 2025. (TrendForce, Jan 8, 2026)
45,000-person labor strike at Samsung memory chip plants could throw a wrench into the AI boom; potential 18-day halt; up to 100 trillion KRW in losses. (Fortune, May 17, 2026)
Micron Technology started manufacturing 1α (1-alpha) DRAM at Manassas, Virginia — the most advanced memory chip ever made in the USA. (Potomac Local, May 25, 2026)
Micron selected Bechtel as EPC partner for first phase of $100B semiconductor campus in Clay, New York; Bechtel mobilizing immediately. (ENR, Jun 15, 2026)
Micron Technology appoints Dr. Alexis Black Björlin to board of directors; AI infrastructure expertise; prior roles at Nvidia and Meta. (Quiver Quantitative, Jun 10, 2026)
Micron's stock tripled in 2026 after UBS raised price target to $1,625; Micron joins Apple, Nvidia, Microsoft in $1T club. (Fortune, May 27, 2026)
ev_072A-2
Sourcewikipedia:pageviews·Captured
Micron_Technology en.wikipedia monthly pageviews: Jan 2026: 43,882; Feb 2026: 31,697; Mar 2026: 42,334; Apr 2026: 30,845; May 2026: 89,530 (2.9x baseline spike); Jun 2026 partial: 31,758. May spike correlated with $1T market cap milestone, Trump endorsement May 22, Manassas 1α DRAM production start.
Micron Q2 FY2026: 196% revenue surge; multi-year supply deals including NVIDIA signed; 30% dividend hike; 60-70% of DDR5 demand locked under long-term contracts; HBM3E sold out. (Ad Hoc News, May 26, 2026)
Samsung Electronics won long-awaited Nvidia validation for its 12-layer HBM3E, clearing a critical hurdle in the HBM supply race. (KED Global, Sep 19, 2025)
Micron began manufacturing 1-alpha (1α) DRAM at Manassas, Virginia as part of $2B expansion — most advanced memory technology ever produced domestically in the United States. (Digitimes, May 24, 2026)
After Micron exited consumer DRAM Dec 2025, Samsung and SK Hynix are the only remaining suppliers; SK Hynix may also trim consumer memory exposure. (Notebookcheck, Jan 12, 2026)
Micron appoints former Nvidia/Meta exec Alexis Black Björlin to board; accelerates NY megafab with Bechtel as AI infrastructure commitment. (Ad Hoc News, Jun 14, 2026)
NVIDIA CEO Jensen Huang announced Vera Rubin has entered full production, intensifying competition for HBM4 supply among Samsung, SK Hynix, and Micron. (Business Korea, Jan 6, 2026)
Micron Q4 FY2025 earnings top estimates on DRAM and HBM strength; strong AI-driven data center demand; higher FY2026 guidance issued. (Futurum Group, Sep 26, 2025)
At COMPUTEX 2026, Micron showcased full stack of AI-optimized products including HBM4. MU stock dropped 11% Jun 9 2026 after Nvidia HBM4 nod to rivals for Rubin platform. (Simply Wall St, Jun 9, 2026)
EPO OPS search: pa='micron technology inc' pd within '2020,2026' — total-result-count: 9743. MICRON TECH INC [US] confirmed as applicant. Sample publication: US20260161544 (G06F 12/02 — virtual memory management). Demonstrates extremely active patent portfolio across memory, storage, and compute-adjacent technologies.
ev_090A-1
Sourceepo_published_data_search·Captured
EPO OPS search: pa='fujian jinhua' AND cpc=H10B pd within '2015,2022' — total-result-count: 295. Fujian Jinhua filed 295 H10B-class semiconductor memory patent applications 2015-2022 despite BIS Entity List designation in October 2018. Continued post-designation filings indicate ongoing R&D. H10B covers DRAM, FeRAM, flash, and related memory cell devices — directly overlaps Micron's core business.
ev_091A-1
Sourceepo_published_data_search·Captured
EPO OPS search: pa='united microelectronics' AND ta=DRAM pd within '2015,2020' — total-result-count: 22. UMC had only 22 DRAM-specific EPO publications during 2015-2020, the period of alleged Micron IP transfer. The asymmetry between UMC's thin DRAM portfolio and Jinhua's 295 H10B filings is consistent with UMC serving as a conduit for Micron IP rather than an independent DRAM developer.
DOJ Indictment Nov 2018 — U.S. v. UMC, Fujian Jinhua, Stephen Chen, Kenny Wang, Ho Jian-Feng. Case CR-18-519-LB (ND Cal). Charges: economic espionage (18 USC 1831), trade secret theft (1832), unauthorized access (1030). UMC recruited Micron employees who carried DRAM cell architecture blueprints to UMC then to Jinhua. BIS Entity List Jinhua 2018-10-29. UMC guilty plea 2020, USD 60M fine.
ev_094B-2
Sourcecodex:baseline·Captured
CAC Cybersecurity Review and Product Ban: CAC launched review 2023-03-31, published 2023-05-21. Finding: Micron products present significant cybersecurity risks to China CII supply chain. Remedy: CII operators prohibited from purchasing Micron products. China revenue ~USD 3.3B FY2022 (~16.5% total). Post-ban FY2025 China share ~11%. Widely characterized as retaliatory.
ev_095B-2
Sourcecodex:baseline·Captured
DRAM Price-Fixing Antitrust Investigation 2002-2004: DOJ Antitrust Division investigated DRAM price-fixing cartel. Micron Technology reported the cartel and applied for leniency under DOJ Corporate Leniency Policy, receiving conditional immunity. Samsung, Hynix Semiconductor, and Infineon convicted; executives imprisoned; companies paid USD 300M+ in criminal fines. Civil class action MDL 02-1486 (ND Cal) settled for approximately USD 325M. Micron held conditional leniency from DOJ.
ev_096A-2
Sourcegithub:repos·Captured
GitHub searches across 8 Micron-adversarial queries (security/vuln/breach, CAC ban, UMC/Jinhua trade secret, antitrust, CXMT, firmware CVE, rowhammer, SEC EDGAR). All returned 0 results. GitHub is not a venue for Micron accountability research.